Momentive offers a wide range of bonding and sealing solutions. Our portfolio of advanced silicone adhesives is designed to perform under highly stressful operating environments of today’s advanced automotive electronic devices. Our materials bond to a wide variety of composites, plastics and metals and are tailored to the demands of today’s high-volume manufacturing production processes.
Momentive's bonding materials make your electronic devices more reliable, last longer end perform better even under harsh operating conditions.
The real challenge of choosing the right bonding adhesive depends on several key items and it is important to know and define what is required of the adhesive in the design stage.
Some of the most Important mechanical properties of sealing adhesives include elongation, compressibility, tensile strength, modulus, tear strength and fatigue resistance.
Depending on the nature of the application, a sealing adhesive may require very little strength or great strength. As we move through various temperature conditions substrates could move considerably, requiring that the sealant expands and contract significantly without losing adhesion from the surface.
Dynamic loads, shock, and rapid variations in stress can cause sealing adhesives to fail. Momentive’s portfolio of advanced adhesives are designed to last, incorporating tough and flexible elastomeric properties. Unlike other adhesives that are rigid and brittle, Momentive’s silicone adhesives can repeatedly stretch and return to their original length while maintaining adhesion.
Some important factors to consider:
|Product||System||Cure(1)||Cure Time / Tack Free Time(3)||Color||Flowability||Feature|
|Addisil* 6101 adhesive sealant||1 part||AC||CT 10 min @ 125 °C||Black||Non-flowable||Fast bonding @ 125 °C|
|TSE322||1 part||AC||CT 30 min @ 150 °C||Light blue, Black||Flowable||Fast bonding @ T>125 °C|
|TSE326M-EX||1 part||AC||CT 1 hr @ 150 °C||Red||Flowable||High heat stability|
|TN3005||1 part||CC||TFT < 10 min @ RT||Clear, white, black||Non-flowable||Tin free/ Fast cure/ Low volatile|
|TN3305||1 part||CC||TFT < 10 min @ RT||Clear, white, black||Flowable||Tin free /Fast cure/ Low volatile|
|TN3085||1 part||CC||TFT < 10 min @ RT||White, grey||Non-flowable||Tin free/ Fast cure/ Low volatile|
|RTV210A/224B||2 part (10:1 w/w)||CC||CT 15 min @ RT||Black||Non-flowable||Fast bonding @ ambient|
(1) AC = Addition Cure, CC = Condensation Cure
(2) After 10-30 minutes cure at RT the bond strength is usually sufficient to allow part handling - full cure obtained after 1-3 days at ambient
(3) CT =Cure Time, TFT = Tack Free Time
Product properties are average data and are not to be used as or to develop specifications.
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
Momentive’s dedicated Automotive team is made up of highly experienced Chemists and Application Development Engineers and a network of global application development centers. Our team uses onsite, customer process analysis and a collaborative solution development approach to truly understand customer challenges. We can work with you to develop a complete process, from the first laboratory trials all the way to series production. We have the support and solutions you need today, so you can deliver the next great product of tomorrow.
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