Advanced Silicone Solutions: Outstanding Performance and Reliability
Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation. Momentive has a wide range of products to address these challenges. SilCool™ adhesives and compounds can deliver the high-thermal conductivity, thin bond lines, and low thermal resistance required for high performance components. For eVTOL applications requiring environmental or stress protection, Momentive's silicone adhesives, sealants, coatings, encapsulants, and potting materials can help you reduce costs and soar above the competition.
Watch the video to learn more about our eVTOL Silicone Solutions:
Key Features and Typical Benefits
- Self extinguishing in case of fire
- Maintains critical properties for extended time over a wide range of extreme temperatures from -130°C (-200°F) to 260°C (500°F)
- UV stable and vibration dampening
- UL rated formulations
- Lower volatile solutions available to protect critical electronics
- Very strong adhesion with primer to help support structural integrity
- Thermally conductive materials offering heat dissipation and management
- Electromagnetic shielding and electrically static dissipative solutions
- Range a rapid cure options
- Available in paste to flowable viscosities to accommodate a wide range of application methods
- Excellent track record in flight electronics packaging and electric vehicle powertrains
Potential eVTOL Applications
- Driver instrument sealant & optical display bonding
- Electrical wire sealant
- Electric battery, charger and power equipment encapsulants, TIM and sealing
- Electric invertor, convertor, motor and high voltage potting
- Sensors and components sealing, potting and encapsulation
- Weather and waterproof sealing
- Lighting strike dissipation gap fillers
- Firewall penetration adhesives
- Black box gel encapsulant
- Heat dissipation