A Full Range of Solutions for Electronic Components
Adhesives & Sealants
Optical Bonding Materials
Thermal Interface Materials
Potting and Encapsulating Materials
Unlock the Power of Possibility with Momentive silicones
Adhesives & Sealants
Optical Bonding Materials
Thermal Interface Materials
Potting and Encapsulating Materials
At Momentive, we have been developing innovative silicone solutions for decades. As a global leader in silicones, our products are designed with performance and high-reliability in mind. We have production facilities around the globe, controlling our manufacturing process from the base silicone to the finished product. This ensures you get the performance you need with full quality control over all inputs and a product you expect. We support our customers with state-of-the-art research, application development labs and dedicated industry experts located around the world.
Momentive sealants and adhesives employ leading-edge silicone technologies to help meet performance and productivity challenges in a wide range of electronic applications. Design freedom, long-term performance and productivity needs drive the trend from mechanical assembly to high-speed, automated adhesion. Momentive offers silicone sealants and fast cure silicone adhesives for high-productivity assembly, as well as solutions for electronic components that can allow design flexibility and help provide long-term component reliability under harsh operating conditions.
Momentive has a broad portfolio of optical bonding silicones used in many different types of display applications. InvisiSil* silicones offer long-term reliability for components that operate in extreme conditions. They are available in a range of curing formulations to allow maximum design flexibility while offering long-term reliability to manufacturers of optical displays.
Momentive has a full range of high-performance solutions for heat dissipation. Our SilCool* family of silicone adhesives and compounds deliver the high thermal conductivity, thin bond lines, and low thermal resistance required for critical components.
Momentive’s dielectric potting and encapsulation materials protect electronic components from moisture and harmful contaminants. They can also provide stress relief protection to circuits from thermal, vibration, and mechanical stress. Available in one and two-part products and specialized grades that offer thermal conductivity, flame retardancy, and low volatiles.
Have a challenge with your current product? Setting up a new process and need a new solution?
Long term stability and flexibility over a broad range of extreme high and low temperatures.
Reliable heat dissipation with vibration dampening and strong adhesion strength
Customizable curing methods, a wide viscosity range, and low volatile solutions to fit your application
Momentive Works with innovators across industries to solve complex challenges
*Momentive, InvisiSil, and SilCool are trademarks of Momentive Performance Materials, Inc.